We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
Glass side wiring for display
Simultaneous metal deposition on 3 sides of display board (side wiring technology)
— Product Application
ㆍSubstrate side wiring TV
ㆍSubstrate/Ball/Deposition
Simultaneous metal low temperature deposition technology for 3 sides of display substrate
(3D low temperature deposition method & equipment)
— Advantages and Differences
| Low temperature 3D deposition | other companies 150~200℃ / TETOS 90℃ |
|---|---|
| Excellent 3D wiring adhesion | 60/60㎛ Pitch, 5B (ASTM D3359) |
| Semiconductor IC Metal deposition performance | – EMI shielding performance : Ag-Spray 70dB↓/ TETOS 75dB↑ – Top surface vs. Side deposition comparison : other companies 45%↓/ TETOS 60% |
— Applications and Features
| Applied to display products using three-sided substrate deposition | – Possible to realize boards of various sizes / thickness – Excellent deposited film uniformity (tolerance ≤ 5%) – Excellent electrical conductivity through high purity metal deposition |
|---|---|
| Applied to EMI shield product using chip 5-side deposition | – 3 Layer Metal Application (Sus / Cu / Sus) – Various metal types and thicknesses can be applied – High electromagnetic shielding possible (75dB ↑) |
— OLED vs. Micro LED Display
Other Services
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Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
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Plastic Cored Solder Ball
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method
