KR | CN

Glass side wiring for display


Simultaneous metal deposition on 3 sides of display board (side wiring technology)

Product Application

[Substrate side wiring TV]

[Substrate/Ball/Deposition]


Simultaneous metal low temperature deposition technology for 3 sides of display substrate (3D low temperature deposition method & equipment)

Advantages and Differences
  • 1. Low temperature 3D deposition : other companies 150~200℃ / TETOS 90℃
  • 2. Excellent 3D wiring adhesion : 60/60㎛ Pitch, 5B (ASTM D3359)
  • 3. Semiconductor IC Metal deposition performance

    - EMI shielding performance : Ag-Spray 70dB↓/ TETOS 75dB↑
    - Top surface vs. Side deposition comparison : other companies 45%↓/ TETOS 60%

Applications and Features
  • 1. Applied to display products using three-sided substrate deposition

    - Possible to realize boards of various sizes / thickness
    - Excellent deposited film uniformity (tolerance ≤ 5%)
    - Excellent electrical conductivity through high purity metal deposition

  • 2. Applied to EMI shield product using chip 5-side deposition

    - 3 Layer Metal Application (Sus / Cu / Sus)
    - Various metal types and thicknesses can be applied
    - High electromagnetic shielding possible (75dB ↑)