KR | CN

R to R Sputter


R to R Sputter
  • Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers
  • Performance is given to conductors, insulation, radiator, and electron absorption, depending on the deposition material
  • Used for ultra-fast manufacturing (thickness 0.001μm to 100 μm)
  • Low deviation from the vapour thickness enables high reliability
  • Can form flexible metal layers
  • ECO Green Deposition Method

Vacuum chamber
Vacuum chamber
Touch panel electrode
Touch panel electrode
NFC antenna
NFC antenna
COF circuit
COF circuit
Electromagnetic masking film
Electromagnetic masking film