KR | CN

R to R Plating


R to R Plating
  • Electrolytic and chemical reactions to the film surface in a plating solution
  • Plating of Laser Hall (PTH) in FPCB-circuit
  • Spacial Layer Plating of FCCL
  • Circuit diagram of touch panel
  • Uniform sheet metal thickness control (0.15 μm ~ 200 μm ± 10%)
  • Control of plated film quality (green size, Roughness, etc.)
  • Plating can be done on both sides

R to R Plating

R to R Plating