KR | CN

Plastic Cored Solder Ball


Solder ball for semiconductor packaging(Plastic Cored Solder Ball)

  • Compared to competitors' multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness
  • Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface
  • Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB
TETOS Solder Ball structure
테토스 솔더볼
테토스 솔더볼

Competitive Solder Ball structure
경쟁사 솔더볼
경쟁사 솔더볼