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Patent Status

Patent registration and application status

Status Date of Publication Patent no. Title of the Invention
Registration 2014-08-21 10-1435357 Method for CCL using fine pitch pattern
Registration 2016-01-14 10-1584916 Manufacturing method for solder resister
Registration 2016-01-29 10-1591737 Method for manufacturing filler and method for manufacturing adhesive composition having heat dissipation
Registration 2016-02-11 10-1595182 Method for manufacturing the conductive polymer ball
Registration 2016-03-28 10-1608594 Plating equipment with no contact dipping roller and method using same
Registration 2013-08-29 10-1303590 Complex conductive substrate and method of manufacturing thereof
Registration 2018-02-06 10-1828311 Sputtering apparatus for conductive particles
Registration 2018-02-06 10-1435357 A method of sputtering conductive particles and conductive particles
Registration 2018-05-03 10-1856623 Method of sputtering reflective particles, reflective particles and reflector comprising same
Registration 2018-06-22 10-1872305 Metal ball manufacturing apparatus and manufacturing method thereof
Registration 2018-07-10 10,020,274 USA_Solderball (Overseas application_PCSB)
Registration 2018-06-29 10-1875066 Method for manufacturing a camera shake correcting coil unit and a camera shake correcting coil unit
Registration 2018-07-06 10-1877931 Manufacturing method for solder particle and solder particle
Registration 2018-07-25 10-1883727 EMI shielding particle, EMI shielding composite including the EMI shielding particle, EMI shielding adhesive film including the EMI shielding composite and apparatus including the EMI shielding composite
Registration 2018-07-25 10-1883728 Multi layer structure for electromagnetic interference shield and method for manufacturing a multi layer structure for electromagnetic interference shield
Registration 2018-11-28 10-1924857 Thermal conductive particle
Registration 2012-05-31 10-1153934 Molecular beam evaporation source for vacuum thin film deposition with integral heating unit, method of manufacturing the same, and evaporator
Application 2015-10-21 10-2015-0146446 Heat-resistant tape with adhesive with spherical particles coated with AIN
Application 2016-08-19 10-2016-0105592 Multifunctional particle, multifunctional composite including the multifunctional particle, multifunctional adhesive film including the multifunctional composite and apparatus including the multifunctional composite
Application 2016-10-20 10-2016-0136581 Solder particle
Application 2017-06-16 201710456270.7 China_Solderball (Overseas application_PCSB)
Application 2017-06-20 2017-120239 Janpa_Solderball (Overseas application_PCSB)
Application 2018-04-25 10-2018-0048025 Manufacturing Method of Metal Ball
Application 2017-07-05 10-2018-0077973 Wafer Plating System
Application 2018-07-11 10-2018-0080297 Method of forming wiring on side surface of substrate
Application 2018-08-03 10-2018-0090615 Substrate side deposition apparatus
Application 2018-10-01 10-2018-0116744 A device for depositing a metal film on a surface of a three-dimensional object
Application 2019-02-18 10-2019-0018372 Roll-to-roll sputtering equipment
Application 2019-02-18 10-2019-0018373 Auxiliary rollers for roll-to-roll processes
Application 2019-03-20 10-2019-0031575 LED display module
Application 2019-03-22 10-2019-0032907 A substrate side deposition apparatus having a substrate mounting drum with improved cooling efficiency
Application 2019-03-25 10-2019-0033300 A substrate side deposition apparatus having a shield with improved cooling efficiency
Application 2019-03-26 10-2019-0034037 Substrate Side Deposition Apparatus Improved Deposition Adhesive Force