: Development of Sputtering and Dong-Mount Process
: FCCL Cost Reduction Project
: ITO Film Metal Bezel Spurtering
(merging with 3M, the equipment business Spin-off. Now TETOS)
: Cu dendrite surface Ag sputtering.
(Heat radiation, conductive material)
: Semiconductor Packaging (BGA Soldering) Material
: Metal Spurtering on Nano Fiber, Cupoil, etc. Surface
(Semiconductor Shieldable Replacement, EMI Shielder)