KR | CN

Develop History


FCCL

2000 ~ 2010

: Development of Sputtering and Dong-Mount Process

Vapor deposition equipment

2005 ~ 2011

: FCCL Cost Reduction Project

ITO metal
Bezel

2005 ~ 2011

: ITO Film Metal Bezel Spurtering
(merging with 3M, the equipment business Spin-off. Now TETOS)

Ag paste

2014 ~ Present

: Cu dendrite surface Ag sputtering.
(Heat radiation, conductive material)

Solder ball

2015 ~ Present

: Semiconductor Packaging (BGA Soldering) Material

EMI Film
Metal Deposition

2017 ~ Present

: Metal Spurtering on Nano Fiber, Cupoil, etc. Surface
(Semiconductor Shieldable Replacement, EMI Shielder)