TECHNOLOGY
Develop History
FCCL
2000 ~ 2010
: Development of Sputtering and Dong-Mount Process
Vapor deposition equipment
2005 ~ 2011
: FCCL Cost Reduction Project
ITO metal
Bezel
2005 ~ 2011
: ITO Film Metal Bezel Spurtering
(merging with 3M, the equipment business Spin-off. Now TETOS)
Ag paste
2014 ~ Present
: Cu dendrite surface Ag sputtering.
(Heat radiation, conductive material)
Solder ball
2015 ~ Present
: Semiconductor Packaging (BGA Soldering) Material
EMI Film
Metal Deposition
2017 ~ Present
: Metal Spurtering on Nano Fiber, Cupoil, etc. Surface
(Semiconductor Shieldable Replacement, EMI Shielder)